What is SPI?
In PCB production, Xiechengchuang conducts SPI inspection after solder paste printing. SPI (Solder Paste Inspection) is an important inspection process. It is specially used to check the printing condition of solder paste to ensure that the quality of each solder joint meets the standards. Whether it is SMT or traditional THT, SPI plays an important role in inspection. SPI can help us detect the thickness, location, and even distribution of solder paste, and can also avoid circuit problems caused by soldering defects.
Why we use SPI?
To improve soldering quality: By detecting the condition of solder paste before mounting, SPI can effectively prevent false soldering, poor soldering, etc. caused by solder paste printing problems. This ensures a more stable welding quality of the product and reduces the rework rate, thus increasing productivity.
To reduce waste: SPI’s accurate detection can reduce losses caused by solder paste quality issues, thereby reducing material waste and costs.
To ensure printing consistency: SPI can not only check the quality of single welding, but also conduct batch inspection to ensure that each batch of products can meet consistent welding standards.
How does SPI work?
The SPI system uses high-precision and high-resolution scanning equipment to check the distribution of solder paste. It takes images of the pad surface and analyzes them with software to accurately measure the height, area and position of the solder paste. If we find a problem, the system will immediately alarm and prompt the operator to make adjustments. In this way, every PCB on the production line can undergo strict testing to ensure the final product quality.
Conclusion
Xiechengchuang use SPI technology, which greatly improves the automation and accuracy of PCB production. It not only reduces production costs, but also ensures the consistency and reliability of customer products. With the continuous development of smart manufacturing, SPI inspection is also constantly upgraded, becoming an indispensable part of the PCB patch assembly process.
上一篇: 没有了！